IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel optoelectronic signal processing via the combination of SAW and semiconductor heterostructures

1998 IEEE Ultrasonics Symposium. Proceedings

Author(s): Streibl, M. ; Rocke, C. ; Govorov, A.O. ; Wixforth, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Sendai, Japan, Japan
Conference Date: 5 October 1998
Volume: 1
ISBN (Paper): 0-7803-4095-7
ISSN (Paper): 1051-0117
DOI: 10.1109/ULTSYM.1998.762109
Regular:

The combination of surface acoustic waves (SAWs) and the superior electrical and optical properties of band-gap engineered semiconductor layer systems yields a completely new and promising... View More

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