IEEE - Institute of Electrical and Electronics Engineers, Inc. - Rheological analysis of an underfill material

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Rasiah, I.J. ; Ho, P.S. ; Manoharan, M. ; Ng, C.L. ; Chau, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 354 - 358
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756029
Regular:

In microelectronics packaging, flip-chip interconnection is gaining momentum as it accommodates thinner packages, higher I/O and shorter electrical connections, hence reducing heat generation and... View More

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