IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructural evolution of low temperature solders in solder joints on a flexible substrate

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Muralidharan, G. ; Tsang, C.F. ; Corpuz, V.G. ; Pooh, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 302 - 307
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756020
Regular:

Surface mount technology is widely practiced in present day electronic component assembly. Low temperature solders are finding increasing applications, primarily when polymeric materials are... View More

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