IEEE - Institute of Electrical and Electronics Engineers, Inc. - The influence of fillet height of a low modulus die attach on the wirebondability of a plastic package

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Rasiah, I.J. ; Leong, W.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 291 - 295
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756018
Regular:

There is a general shift in plastic package size towards larger and thinner dice. This can be seen in the dramatic increase in the number of QFP type packages produced in the semiconductor... View More

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