IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurement of residual stresses in encapsulant of a PQFP

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Lee, D.C.Y. ; Kim, J.-K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 286 - 290
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756017
Regular:

This paper reports a preliminary result of residual stresses measured on a plastic quad flat pack (PQFP) using the hole drilling strain gauge (HDSG) method. The experimental results are compared... View More

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