IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability assessment of transfer molded CSP

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Lee, T.K. ; Teo, Y.C. ; Lim, T.B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 274 - 278
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756015
Regular:

This paper describes the package and board level reliability assessment of a transfer molded chip scale package. Two chip scale package (CSP) designs have been developed, with a full matrix array... View More

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