IEEE - Institute of Electrical and Electronics Engineers, Inc. - Vibration reliability test of a PBGA assembly

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Yang, Q.J. ; Lim, G.H. ; Pang, H.L.J. ; Wang, Z.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 258 - 263
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756012
Regular:

In order to understand vibration fatigue failures in plastic ball grid array (PBGA) solder joints, a series of constant-amplitude vibration tests of a PBGA assembly were conducted. The test... View More

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