IEEE - Institute of Electrical and Electronics Engineers, Inc. - A thermal model of the preheat section in wave soldering

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Hoe, S.L. ; Toh, K.C. ; Chan, W.K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 240 - 245
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756009
Regular:

This paper presents the development of a numerical model for the determination of the temperature profile in the preheat section of wave soldering equipment. The model takes into consideration the... View More

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