IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal transient testing of packages without a tester

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Szekely, V. ; Rencz, M. ; Courtois, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 236 - 239
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756008
Regular:

Thermal transient testing is an excellent method to measure the thermal properties of packages, to check die attach quality and to detect and localise physical defects in the heat removal path.... View More

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