IEEE - Institute of Electrical and Electronics Engineers, Inc. - The enhanced cooling of IC chip arrays on printed circuit boards

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Low, K.W. ; Yap, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 229 - 235
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756007
Regular:

The dissipation of heat generated is a key limiting factor to further miniaturization of electronic circuits. Forced convection cooling of these circuits is an economical and efficient technique... View More

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