IEEE - Institute of Electrical and Electronics Engineers, Inc. - WAVE/sup TM/ technology for wafer level packaging of ICs

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Fjelstad, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 214 - 218
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756004
Regular:

Wide area vertical expansion (WAVE) technology promises to provide a relatively easy method for cost effectively interconnecting ICs while still on the wafer. Based on concepts that allow for the... View More

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