IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel rework techniques for electronic assemblies

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Stennett, A.D. ; Whalley, D.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 196 - 201
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.756001
Regular:

Soft soldering is the primary joining technology used in electronics assembly and is expected to remain so for the foreseeable future. Component removal for rework and repair is traditionally... View More

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