IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lifetime and damage assessment for CSPs and related microelectronic structures: experimental validation plus computer modeling

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Albrecht, J.-J. ; Birzer, Ch. ; Muller, W.H. ; Jendrny, J. ; Pape, H. ; Schwarz, B. ; Teichmann, H. ; Tilgner, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 177 - 183
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755998
Regular:

The fatigue and damage of solder joints and the potential for interface failure within chip scale packages (CSP) are primarily caused by thermal loading. The thermally induced residual stresses... View More

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