IEEE - Institute of Electrical and Electronics Engineers, Inc. - Finite element analysis of plastic-encapsulated multi-chip packages

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Tay, A.A.O. ; Ong, S.H. ; Lee, L.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 170 - 176
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755997
Regular:

This paper describes a three-dimensional finite element study of the residual stress distribution induced inside two plastic-encapsulated multi-chip packages (MCPs) after post-mold-cure.... View More

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