IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cooling solutions for a no-air-flow and low-junction-temperature application

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Wang, D.G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 133 - 137
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755991
Regular:

Thermal management problems involving PCI cards are growing as devices and components on the cards are dissipating more power. The spacing limitation, i.e. spacing between cards, as well as... View More

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