IEEE - Institute of Electrical and Electronics Engineers, Inc. - EBGA: high frequency electrical characterization and the influence of substrate design parameters on package performance

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Qiu, Y. ; Iyer, M.K. ; Chong, K.C. ; Zhang, T.L. ; Rasiah, I.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 107 - 111
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755987
Regular:

Thermally enhanced ball grid array (EBGA) packages are studied for their electrical performance and the results are reported in this paper. The electrical parasitics of these EBGA packages are... View More

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