IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel method for simultaneous switching noise analysis in electronic packages

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Zhang, J. ; Iyer, M.K. ; Ooi, B.L. ; Leong, M.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 95 - 98
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755985
Regular:

In this paper, a novel method is described for simultaneous switching noise (SSN) analysis in a 208 pin plastic quad flat package (PQFP). A two-port S matrix of the pins, and the coupling between... View More

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