IEEE - Institute of Electrical and Electronics Engineers, Inc. - Flip chip on board mounting processes using anisotropic conductive adhesives and eutectic solder

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Zhong, Z. ; Wong, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 76 - 82
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755982
Regular:

In this study, flip chip on board evaluations were carried out using Taguchi design of experiments. Simple but high yield procedures for rework of flip chip on board using anisotropic conductive... View More

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