IEEE - Institute of Electrical and Electronics Engineers, Inc. - Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Jang, S.-Y. ; Paik, K.-W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 69 - 75
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755981
Regular:

In flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder wettability. Various... View More

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