IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Schubert, A. ; Dudek, R. ; Doring, R. ; Michel, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 49 - 56
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755978
Regular:

One major concern over thermally induced mechanical stress is that it causes reliability problems in electronic device packaging and interconnects. IC packaging has accelerated development of flip... View More

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