IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thin film failure using an interface delamination law

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Liu, P. ; Cheng, L. ; Zhang, Y.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 43 - 48
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755977
Regular:

Interfacial debonding of multilayer thin film systems in microelectronics can severely affect device functionality and reliability. There is great engineering value in quantitative evaluation of... View More

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