IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of plastic chip scale package for ATM switching systems

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Harada, A. ; Kaizu, K. ; Yamanaka, N. ; Kawamura, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 30 - 35
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755975
Regular:

A plastic chip-scale package (CSP) smaller than conventional packages has been developed and applied to ATM switching systems. The package uses a low-cost glass-epoxy substrate. As glass epoxy is... View More

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