IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fine geometry and fine pitch bumping process

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Viswanadam, G. ; Sathappan, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 18 - 24
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755973
Regular:

Photosensitive dry films are widely used in the electronics circuit assembly industry for pattern development. This paper demonstrates the use of dry films in conjunction with solder paste... View More

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