IEEE - Institute of Electrical and Electronics Engineers, Inc. - The mini flex ball-grid-array chip-scale package

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Ang, S. ; Meyer, D. ; Thach, T. ; Schaper, L. ; Brown, W.D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
Page(s): 13 - 17
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755972
Regular:

The reliability of the mini-flex ball grid array chip scale package (mF-BGA CSP) was investigated. Thermal shock testing on these packages revealed that both the underfill and test board... View More

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