IEEE - Institute of Electrical and Electronics Engineers, Inc. - New era for high performance and low cost semiconductor packaging

Proceedings of 2nd Electronics Packaging Technology Conference

Author(s): Tsukada, Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Singapore, Singapore
Conference Date: 10 December 1998
ISBN (Paper): 0-7803-5141-X
DOI: 10.1109/EPTC.1998.755971
Regular:

Summary form only given. We cannot consider the future of packaging without the requirements for IC innovation. These requirements are described extensively in the SIA roadmap, including the... View More

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