IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and characterization of wire bonding and tape automatic bonding. Analytical formulas and experimental validation

Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference

Author(s): Hassaine, N. ; Shen, Y. ; Ntake, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Colorado Springs, CO, USA, USA
Conference Date: 9 August 1998
Page(s): 281 - 284
ISBN (Paper): 0-7803-4988-1
DOI: 10.1109/RAWCON.1998.709191
Regular:

A simplified method has been established to model and characterize two types of short interconnections: wire bonding and tape automatic bonding (TAB). A comparison between these two parasitic... View More

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