IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interconnect and substrate modeling and analysis: an overview

Proceedings of the 1997 Bipolar/BiCMOS Circuits and Technology Meeting

Author(s): Chiprout, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Minneapolis, MN, USA
Conference Date: 28 September 1997
Page(s): 158 - 165
ISBN (Paper): 0-7803-3916-9
ISSN (Paper): 1088-9299
DOI: 10.1109/BIPOL.1997.647425
Regular:

Accurate models for metal interconnect, silicon substrate and packaging have become necessary for accurate simulation of high-speed designs. An overview of the hierarchy of techniques used to... View More

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