IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interconnect design for deep submicron ICs

Proceedings of IEEE International Conference on Computer Aided Design (ICCAD)

Author(s): Cong, J. ; Zhigang Pan ; Lei He ; Cheng-Kok Koh ; Kei-Yong Khoo
Sponsor(s): IEEE Circuits & Syst. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 9 November 1997
Page Count: 8
Page(s): 478 - 485
ISBN (Paper): 0-8186-8200-0
ISSN (Paper): 1092-3152
DOI: 10.1109/ICCAD.1997.643579
Regular:

Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of... View More

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