IEEE - Institute of Electrical and Electronics Engineers, Inc. - A high density IC compatible microtransducer/diaphragm design on micro-cavity SOI technology

1997 IEEE Hong Kong Proceedings Electron Devices Meeting

Author(s): Lee, M.M.-O. ; Yang-Ho Moon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Hong Kong, Hong Kong
Conference Date: 30 August 1997
Page(s): 140 - 144
ISBN (Paper): 0-7803-3802-2
DOI: 10.1109/HKEDM.1997.642351
Regular:

This paper demonstrates the cross-functional results for stress analyses (targeting 5 /spl mu/m deflection and 1000 MPa stress as maximum at various applicable pressure ranges), for finding... View More

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