IEEE - Institute of Electrical and Electronics Engineers, Inc. - Merged technology on MEMS

1997 IEEE Hong Kong Proceedings Electron Devices Meeting

Author(s): Lee, M.M.O.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Hong Kong, Hong Kong
Conference Date: 30 August 1997
Page(s): 128 - 135
ISBN (Paper): 0-7803-3802-2
DOI: 10.1109/HKEDM.1997.642349
Regular:

This study presents briefly the review for stress analyses for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from SOI (Silicon On Insulator)... View More

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