IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of the feasibility of dynamic thermal testing in digital circuits

Proceedings Sixth Asian Test Symposium (ATS'97)

Author(s): Altet, J. ; Rubio, A. ; Tamamoto, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Akita, Japan, Japan
Conference Date: 17 November 1997
Page(s): 149 - 154
ISBN (Paper): 0-8186-8209-4
ISSN (Paper): 1081-7735
DOI: 10.1109/ATS.1997.643951
Regular:

Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with... View More

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