IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast first-run silicon repair cases by laser chemical vapor deposition of copper from Cu(hfac)tmvs

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Remes, J. ; Moilanen, H. ; Leppavuori, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 280 - 283
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638353
Regular:

The fast-turnaround ASIC prototype series must be brought into market quickly. Unfortunately, it is often noticed that, despite through simulations, design flaws are introduced into these... View More

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