IEEE - Institute of Electrical and Electronics Engineers, Inc. - Applications of atomic force microscopy for semiconductor device and package characterization

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Natarajan, M. ; Cui, C.Q. ; Poener, D.P. ; Radhakrishnan, M.K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 275 - 279
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638349
Regular:

This paper presents the results of a few case studies carried out on semiconductor devices and packaging related materials. The emphasis is on the novel application of Scanning Probe Microscopy... View More

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