IEEE - Institute of Electrical and Electronics Engineers, Inc. - Contamination analyses of Al bond pads using FIB/SEM/EDX

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Zhao, S.P. ; Hua, Y.N. ; Goh, G.P. ; Guo, Z.R. ; Chau, K.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 254 - 259
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638339
Regular:

Aluminum bond pads on semiconductor chips play an important role in IC device reliability and yield. Contaminated Al bond pads can cause poor intermetallic growths, thus failed or unreliable... View More

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