IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of humidity and temperature cycling on 3-D packaging

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Evans, J.Y. ; Evans, J.W. ; Li, M.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 213 - 218
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638208
Regular:

Three dimensional electronics packaging technologies are emerging for many electronics system applications. Characterizing failure mechanisms, was the focus of this research. Accelerated testing... View More

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