IEEE - Institute of Electrical and Electronics Engineers, Inc. - FIB precision TEM sample preparation using carbon replica

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Sheng, T.T. ; Goh, G.P. ; Tung, C.H. ; Wang, J.L.F. ; Jeng Kou Cheng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 92 - 96
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638150
Regular:

A new precision transmission electron microscopy (XTEM) sample preparation method was developed and reported here. No mechanical polishing and grinding are needed. The main difference of this... View More

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