IEEE - Institute of Electrical and Electronics Engineers, Inc. - Combination of focused ion beam (FIB) and transmission electron microscopy (TEM) as sub-0.25 /spl mu/m defect characterization tool

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Yih-Yuh Doong ; Jui-Mei Fu ; Yong-Fen Hsieh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 80 - 85
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638125
Regular:

A sub-0.25 /spl mu/m defect characterization study was conducted by using in-line inspection machines to locate defects and focused ion beam system (FIB) equipped with a navigation tool to... View More

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