IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermomechanical and electromigration studies with a high sensitive and high resolution laser probe

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Dilhaire, S. ; Phan, T. ; Schaub, E. ; Claeys, W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 62 - 67
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638122
Regular:

A high sensitive and high resolution laser probe devoted to the thermomechanical and electromigration studies of microelectronic interconnects has been developed. It provides information, at... View More

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