IEEE - Institute of Electrical and Electronics Engineers, Inc. - Sample preparation for electron beam testing with reactive ion etching

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Numajiri, T. ; Suzuki, S. ; Omata, T. ; Yoshida, N. ; Tsujita, Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 56 - 61
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638121
Regular:

A practical sample preparation procedure for electron beam (EB) testing using reactive ion etching (RIE) has been developed. By highly accurate anisotropic dry etching, metal wires below... View More

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