IEEE - Institute of Electrical and Electronics Engineers, Inc. - Plasma cleaning for plastic ball grid array (PBGA): a study on surface cleanliness, wire bondability and adhesion

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Lee, C. ; Tan Check-Eng, R. ; Ong Wai-Lian, J. ; Gopalakrishnan, R. ; Nyunt, K. ; Wong, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 50 - 55
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638120
Regular:

An investigation of O/sub 2/, Ar and Ar/H/sub 2/ plasma cleaning was carried out on PBGA substrates to study its effects on surface cleanliness, wire bondability and moulding compound/solder mask... View More

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