IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructural and compositional failure analysis of Cr-CrCu-Cu thin films for ball grid array (BGA) applications

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Na Zhang ; McNicholas, M. ; Colvin, N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 44 - 49
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638119
Regular:

A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of... View More

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