IEEE - Institute of Electrical and Electronics Engineers, Inc. - Finite element analysis for solder ball failures in chip scale package

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Taekoo Lee ; Jinhyuk Lee ; Ilgyu Jung
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 39 - 43
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638070
Regular:

In this study, the failure mechanism of solder ball connect in chip scale packaging (CSP) utilizing wire-bonded ball grid array was elucidated using finite element analysis. The... View More

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