IEEE - Institute of Electrical and Electronics Engineers, Inc. - Infrared imaging and backside failure analysis techniques on multilayer CMOS technology

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Author(s): Chen, S. ; Shinseki, B. ; Barutha, C. ; Ty Kha
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Singapore
Conference Date: 25 July 1997
Page(s): 17 - 20
ISBN (Paper): 0-7803-3985-1
DOI: 10.1109/IPFA.1997.638066
Regular:

Infrared (IR) laser scanning microscopy (LSM) techniques have been characterized and developed to provide better root cause backside failure analysis (BFA) on products fabricated on multilayer... View More

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