IEEE - Institute of Electrical and Electronics Engineers, Inc. - Gold plated contacts: effect of thermal aging on contact resistance

Electrical Contacts - 1997 Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts

Author(s): Antler, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Philadelphia, PA, USA, USA
Conference Date: 20 October 1997
Page(s): 121 - 131
ISBN (Paper): 0-7803-3968-1
DOI: 10.1109/HOLM.1997.638004
Regular:

A study was made of the effect of thermal aging on the contact resistances of pure and of cobalt- and nickel-hardened gold platings (Hard Golds) on copper. Samples were aged at several... View More

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