IEEE - Institute of Electrical and Electronics Engineers, Inc. - Capacitive leadframe testing

Proceedings International Test Conference 1997

Author(s): Turner, T.T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Washington, DC, USA, USA
Conference Date: 6 November 1997
ISBN (Paper): 0-7803-4209-7
ISSN (Paper): 1089-3539
DOI: 10.1109/TEST.1997.639603
Regular:

Reliable pin-level diagnosis of open solder joints allows manufacturers to tune SMT process for maximum output. Repair time and repair-induced damage are both significantly reduced with pin-level... View More

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