IEEE - Institute of Electrical and Electronics Engineers, Inc. - SOI materials defect characterization

1997 IEEE International SOI Conference Proceedings

Author(s): Pham, D.T. ; Bich-Yen Nguyen ; O'Meara, D. ; Wang, V. ; Nguyen, N. ; Smith, J. ; Veteran, J. ; Mendicino, M. ; Campbell, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Fish Camp, CA, USA, USA
Conference Date: 6 October 1997
Page(s): 144 - 145
ISBN (Paper): 0-7803-3938-X
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.1997.634974
Regular:

In this study, the SOI wafers made by various bonding or implant techniques were extensively characterized for physical defects using various metrologies such as optical, X-ray, electron... View More

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