IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low temperature Si layer splitting

1997 IEEE International SOI Conference Proceedings

Author(s): Tong, Q.-Y. ; Lee, T.-H. ; Huang, L.-J. ; Chao, Y.-L. ; Gosele, U.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Fish Camp, CA, USA, USA
Conference Date: 6 October 1997
Page(s): 126 - 127
ISBN (Paper): 0-7803-3938-X
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.1997.634965
Regular:

Wafer bonding opens up new design possibilities for the fabrication of various single crystalline semiconductor on insulator (SOI) materials. SOI has been realized by layer splitting... View More

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