IEEE - Institute of Electrical and Electronics Engineers, Inc. - 1.3 /spl mu/m CMOS technology merged with 90 V HG-DMOS on SOI substrate

1997 IEEE International SOI Conference Proceedings

Author(s): Ohyanagi, T. ; Watanabe, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Fish Camp, CA, USA, USA
Conference Date: 6 October 1997
Page(s): 72 - 73
ISBN (Paper): 0-7803-3938-X
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.1997.634938
Regular:

Summary form only given. The utilization of SOI substrates for Power Integrated Circuits (PICs) is a promising solution for the accumulation of circuits, because a circuit can be more compact due... View More

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