IEEE - Institute of Electrical and Electronics Engineers, Inc. - Semiconductor layer transfer by anodic wafer bonding

1997 IEEE International SOI Conference Proceedings

Author(s): Lee, T.-H. ; Tong, Q.-Y. ; Chao, Y.-L. ; Huang, L.-J. ; Gosele, U.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Fish Camp, CA, USA, USA
Conference Date: 6 October 1997
Page(s): 40 - 41
ISBN (Paper): 0-7803-3938-X
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.1997.634922
Regular:

High quality and low cost single crystalline semiconductor on glass (SOG) wafers are highly desirable, e.g., for flat panel displays and solar cells (Si on glass), sensors (Ge on glass) and GaN... View More

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