IEEE - Institute of Electrical and Electronics Engineers, Inc. - TFSOI-can it meet the challenge of single chip portable wireless systems?

1997 IEEE International SOI Conference Proceedings

Author(s): Huang, W.M. ; Monk, D.J. ; Diaz, D.C. ; Welch, P.J. ; Ford, J.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Fish Camp, CA, USA, USA
Conference Date: 6 October 1997
Page(s): 1 - 3
ISBN (Paper): 0-7803-3938-X
ISSN (Paper): 1078-621X
DOI: 10.1109/SOI.1997.634904
Regular:

Tremendous progress in understanding and improving SOI material and devices has been made in recent years. The reduced junction capacitance and the minimal body-effect of SOI provides an inherent... View More

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